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  • X-Ray Inspection Machine

  • 采用 X 光透射成像原理,对PCB制程中压合和钻孔工序对内层孔进行观测和检查
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详情介绍

Instrument model: YX-12XG

Instrument use
The X optical transmission imaging principle is used to observe and inspect the inner hole in the compression and drilling procedures in the PCB process.

Characteristic of instrument
1. the imported sealed microfocal X ray tube and the X image intensifier are used to ensure the clear image.
2. navigation high-definition camera, to the designated position to observe, the visual dynamic display of the observation.
3., in the static and dynamic situation, 4. of the machines can be highly reliable, X ray multiple protection measures (sealed micro focus X ray tube, semi closed lead protection and double lead rubber protective curtain), so as to ensure the safety and reliability of the operators.
4., the software uses a variety of image processing and measurement technology, real-time observation and measurement of the center position, point to point distance, circular area, etc., and can be combined with four diagrams.

Technical parameters:
Technical parameters of the project
The measurement accuracy of 50 m
Resolution 21lp/cm
Check the PCB plate thickness is more than 26 floors below
Visibility range [Phi] 20mm
Perspective magnification 8X to 64X
X optical tube maximum voltage: 50kV, maximum current: 1mA, maximum power: 50W
The radiation leak is less than or equal to 0.5 SV/h
Special software YX-XG Lite
Shape size 1050*840*1500mm
Weight 140Kg

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